We Offer a Wide Range of PCB Capabilities to Fit Your PCB Needs

Rapidden Technology Limited is a professional quick-turn PCB prototyping, PCB Assembly and low to medium volume production manufacturer located in Guangdong–Hong Kong–Macao Greater Bay Area.
Whether it is a single board for a prototype or volume production runs, Rapidden Technology Limited will meet your PCB manufacturing needs in a variety of materials and technologies, with an unwavering commitment to UL certification standards.
We focus on multi-layer printed circuit boards, impedance Controlled circuit boards and HDI PCBs in varying complexities to make sure our clients always receive the best possible product.

PCB Technical Capabilities

Item PCB Capabilities
Number of Layers
1, 2, 4 Or 6, up to 40 Layers
Order Quantity
1 to 500,000
Board Shape
Rectangular, Round, Slots, Cutouts, Complax, Irregular
Board Type
Rigid, Flex, Rigid-Flex
Board Material
FR-4 Flass Epoxy, FR4 High Tg, RoHS Compliant, Aluminium, Rogers
Board Cutting
Shear, V-Score, Tab-Routed
Board Thickness
0.2~4.0 mm, Flex 0.01~0.25
Cooper Weight
0.5, 1, 1.5, 2, 2.5, 3 oz
Solder Mask
Double-sided Green Lpi, Also Support Red, White, Yellow, Blue, Black
Silk Screen
Double-sided Green Lpi, Also Support Red, White, Yellow, Blue, Black
Silk Screen Min Line Width
0.006″ or 0.15 mm
Max Board Dimensions
20 inch*20 inch or 500 mm*500 mm
Min Trace / Gap
0.10 mm or 4 mils
Min Drill Hole Diameter
0.008″, 0.2 mm, or 8 mils
Surface Finish
HASL, Nickel. Imm Gold, Imm Silver, OSP etc.
Board Thickness Tolerance
+-10%
Copper Weight Tolerance
+- 0.25 oz
Minimal Slot Width
0.12″, 3.0 mm, or 120 mils
V-score Depth
20-25% of Board Thickness
Plated Through Holes
Yes
Sink Holes
Yes
Design File Format
Gerber RS-274X, 274D, Eagle, and AutoCAD’s DXF, DWG

Making PCBs - PCB Manufacture step by step

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01. Pre Production Engineering
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02. Board Cutting
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03. Print Inner Layers
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04. Etch Inner Layers
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05. Inner Layer AOI
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06. Lay-up and Bond
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07. Drilling the PCB
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08. Electroless Copper Deposition
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09. Image the Outer Layers
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10. Plating
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11. Etch Outer Layer
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12. Outer Layer AOI
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13. Soldermask
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14. Surface Finish
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15. Profile
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16. Electrical Test
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17. Final Inspection
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18. Packaging