| Classification | Items | Capability |
| Number of layers | Layers | 1-32Layers |
| Materials | Base Material | S1000-2M, S1000H, S1141, KB6160, KB6164, KB6167, IT180A, TU768, TU865 |
| High Frequency Material | RO3003, RO4003, RO4350B | |
| Halogen Free FR4 | S1150G, S1165, TU862HF | |
| Product | Board Thickness | 0.1mm-6mm |
| Max board size | 1200×600mm | |
| Copper Thickness | 1/3OZ-16OZ | |
| Min Laser Hole | 0.1mm | |
| Solder Mask Colours | Green/Black/Blue/Red/White/Yellow/Matt | |
| Inner-layer Graphics | 1/3 OZ | Min track width/space:2.7mil/2.7mil |
| 0.5 OZ | Min track width/space:2.8mil/2.8mil | |
| 1.0 OZ | Min track width/space:3mil/3mil | |
| 2.0 OZ | Min track width/space:5.0mil/5.0mil | |
| 3.0 OZ | Min track width/space:6.0mil/7.5mil | |
| 4.0 OZ | Min track width/space:7mil/11.5mil | |
| 5.0 OZ | Min track width/space:10mil/16mil | |
| 6.0 OZ | Min track width/space:10mil/10.5mil | |
| Outer-layer Graphics | 1/3 OZ | Min track width/space:2.7mil/2.7mil |
| 0.5 OZ | Min track width/space:2.8mil/2.8mil | |
| 1.0 OZ | Min track width/space:3.0mil/3.0mil | |
| 2.0 OZ | Min track width/space:5mil/5.5mil | |
| 3.0 OZ | Min track width/space:6.0mil/7.5mil | |
| 4.0 OZ | Min track width/space:13mil/11mil | |
| 5.0 OZ | Min track width/space:14mil/12mil | |
| 6.0 OZ | Min track width/space:18mil/17mil | |
| Through Hole | Max Hole Diameter | 6.5mm, thickness < 6.4mm |
| Min Hole Diameter | 0.15mm, thickness < 1.0mm | |
| Hole tolerance | NPTH Tolerance:±0.05mm PTH Tolerance:±0.075mm Crimping Hole:±0.05mm | |
| Deep Hole Control | Minimum depth control hole diameter | 0.155mm |
| Depth Control Accuracy | 0.1mm | |
| Hole Depth Thickness Diameter Ratio | ≤0.6:1 | |
| Control depth groove depth tolerance | ±0.15mm | |
| Laser Hole | Outer line width and line spacing | 3.5mil/4mil |
| Inner line width and line spacing | 3.0mil/3.5mil | |
| Laser blind hole thickness to diameter ratio | ≤0.6:1 | |
| Laser Blind Hole Medium Thickness | 2.5mil-4mil | |
| Stepped Hole | Step hole diameter tolerance | 0.1mm |
| Step hole depth tolerance | 0.2mm | |
| Countersunk Hole | Countersunk drill diameter | 45° countersunk bit diameter is 4.5mm |
| 60°, 82°, 90° countersunk bit diameter is 6.35mm | ||
| 100° countersunk bit diameter is 6.5mm | ||
| PTH Countersunk Ring Width | 8mil | |
| PTH countersunk hole distance line | 12mil | |
| Back Drilling | Depth Tolerance | ±0.1mm |
| Hole to outer line distance | ≥0.15mm | |
| Hole to inner line distance | ≥0.175mm | |
| Position Tolerance | ±0.1mm | |
| Surface Treatment | ENIG(Electroless Nickel/Immersion Gold) | Au thickness:1μ”-5μ” Nickel Thickness:2μm-5μm |
| Plating Gold | Au thickness:1μ”-5μ” Nickel Thickness:2μm-7.6μm | |
| Gold Finger | Au thickness:1μ”-120μ” | |
| ENEPIG | Au thickness:1μ”-5μ” Palladium thickness:4μ”-20μ” Nickel Thickness:2μm-5μm | |
| Immersion Tin | Tin Thickness:0.8μm-1.2μm | |
| Immersion Silver | Silver Thickness:0.15μm-0.4μm | |
| OSP | YES | |
| Lead Free HASL | YES |
